Thin film preparation and manipulation and lithography
Thin film preparation and manipulation and lithography
Thin film preparation and manipulation and lithography
Thin film preparation and manipulation and lithography
Thin film preparation and manipulation and lithography
Thin film preparation and manipulation and lithography
The Instituto de Nanociencia y Materiales de Aragón has a wide range of techniques for the preparation of thin films (sputtering, evaporation, various deposition techniques, laser ablation… ) and equipment for the nanostructuring of thin films.

1) Thin Film Growth Platform (PLD & Sputtering)

The combination of all these equipments constitutes a unique platform that allows the controlled growth of nanometric thin films and multilayers of epitaxial complex oxides, non-crystalline and of very high crystalline quality. It allows the growth of these materials in conditions far from thermodynamic equilibrium and in ultra-high vacuum.
In particular the equipment combined with a PLD and Sputtering growth system and assisted with a cryopump is unique and allows the growth of pure metals. The unusual combination of these two growth systems allows to combine oxide and metal growths without breaking vacuum which allows to obtain clean and uncontaminated interlayers.

Contact: Irene Lucas (

2) Sputtering AJA Int. (ATC Orion)

5-barrel confocal sputtering (2-inch/5cm targets) for wafers up to 4 inches, with 1 barrel for magnetic materials. Power supplies 2xDC, 1xRF.
The equipment has a heater up to 800 oC. It can be used in multilayer mode, co-sputtering, and reactive sputtering with N2.

Contact: Pedro Algarabel ( / Pavel Strochovanec (

Equipment for the preparation of thin films in ultra-high vacuum by controlled evaporation of materials.

– Atomic control of the deposit

– On-site control of crystalline structure

– Deposit temperature control 20 C-700 C

Contacto: Miguel Ciria (

A set of six Langmuir vats for Langmuir-Blodgett film preparation as well as monolayer characterization techniques at the air-water interface (Kelvin probe, UV-vis reflection and Brewster angle microscopy). The group also has quartz microbalances for in situ monitoring of self-assembled film formation and a potentiostat for electrografting and electrodeposition.

Contact: Pilar Cea (

2)Screen_printer semi-automatic
This is equipment for depositing semiconductor pastes on a support (usually a conductive glass) with high precision and good reproducibility. It is a technique suitable for building photoelectrodes in dye solar cells (DSSC). The technique can be applied to other areas.

2) Spin_coater
Allows deposition of thin films with excellent control and reproducibility on glass electrodes. Model WS-650 MHz-23NPPB.

Contact: Santiago Franco (

It is an enormously versatile chamber. It has Ar and O2 and N2 supply for reactive sputtering. It can grow films by single sputtering or cosputtering and multilayers by automated sequential deposition. The equipment includes two DC sources, one RF and one pulsed DC. The chamber also has a high temperature station up to 950 ºC.

Contact: Mª Ángeles Laguna ( / Fernando Bartolomé (

Dielectric etching and deposition equipment (RIE600-PCVD-Gas Analysis; Ion Milling (ion etching); RIE; PECVD); electron gun evaporator (e-beam PVD); chemical bench in room 10000 for wet etching (KOH, HF…. ); mask aligner for UV lithography, deposition station, photoresist and hot plate spinner (photolithography and SU8 photolithography); chemical bench in room 100 (photolithography; SU8 photolithography).

Pickling, lift-off, cleaning…; profilometer, micro-contacts, dicing/slicing saw; microtips station (anodic bonding) and optical microscope.

More information: LMA Servicio Microfabricación


Equipment for printing by the NIL technique, can work with pressures up to 8 bar and temperatures up to 200ºC. It also has the possibility of UV lithography. For the user it is necessary to have the stamp to be printed.


Pilar Pina  ( /
Reyes Mallada (

Accurate automated micro-dispensing of liquids.
Dispensing is performed by a non-contact piezo electric system. Ultra-small volumes between 30 – 800 pL/drop can be dispensed, Sci Flex Arrayer 3 (SCENION) equipment.

Contact: Pilar Pina  ( / Reyes Mallada (

Lithography with molecules or nanoparticles (inks) at micro and nanoscale. Environmental chamber to control atmosphere, humidity and temperature. Allows: i) design, calibrate patterns; ii) manufacture patterns by deposition of the “inks” with the AFM tip/array of AFM tips; iii) characterise the patterns by means of AFM. It is the only technique capable of nanostructuring/nano-positioning molecules on surface or embedded in sensors under ambient conditions.

Contact: Ana Isabel Gracia Lostao (

Ultra-high vacuum thin film deposition equipment, with 56 sputtering targets, and an electron beam evaporation source with 6 crucibles. Deposition of 4” wafer wafers. Power supplies for deposition of different materials, including 2 DC, one pulsed DC and one RF. The substrate can be heated up to 800C.


Contact: Amalio Fernández-Pacheco (

Este sitio web utiliza cookies para que usted tenga la mejor experiencia de usuario. Si continúa navegando está dando su consentimiento para la aceptación de las mencionadas cookies y la aceptación de nuestra política de cookies

Aviso de cookies